curtinengineering.com
Sean Curtin
Mechanical Engineering Student — CAD, FEA & DFM
Seeking 12-month F1 placement in CAD / Design Office / Model Shop / Manufacturing Support
Irish & American citizen — full UK/EU work rights
Mechanical engineering student who ships real products. FEA-validated commercial parts, SOLIDWORKS training at Dassault Systèmes, and a Formula 1 simulation validated against real telemetry.
My Projects:
Automotive Cup Holder for Volvo 960
What it is: Direct-fit, FEA-validated replacement cup holder for classic Volvo.
Objective:
Replace fragile OEM cupholder (~$500) with affordable, robust, no-modification solution.

Outcomes & Contributions:
Diagnosed 73.3 MPa stress concentration via FEA
Reduced peak stress 80% — 73.3 MPa → 14.77 MPa, FoS > 3.4
Took design through 7 prototypes to commercial sale on Cults3D


Technical Details & Skills:
SOLIDWORKS, SOLIDWORKS Simulation
DFM: tolerance adjustments, gussets, modular design
Skills: Reverse Engineering, FEA, DFM, 3D Printing


Laptop-to-Desktop Chassis
What it is: 17-part parametric enclosure converting broken laptop into desktop workstation.

Objective:
Give new life to a laptop with dead screen and thermal issues; improve cooling and noise.


Outcomes & Contributions:
+10.5% FPS, 43% perceived noise reduction, zero crashes
Designed modular no-glue dovetail/peg system
Video selected for official SOLIDWORKS YouTube channel (242K subscribers)

Technical Details & Skills:
SOLIDWORKS parametric modeling, master sketch
DFM for 3D printing (build plate, supports)
Internal ducting, Fill Pattern mesh
Skills: CAD, DFM, Thermal Testing, Technical Documentation
Formula 1 Acceleration Model
What it is: MATLAB simulation of F1 acceleration validated against real telemetry.
Objective:
Model nonlinear acceleration including aerodynamics, rolling resistance, and hybrid powertrain effects.
Outcomes & Contributions:
Derived and solved nonlinear ODE in MATLAB (ode45)
Validated against 2024 British GP Red Bull RB20 telemetry
Incorporated real throttle/DRS data, drivetrain efficiency, and rotational inertia
Reduced MAPE 3.70% → 2.65% — 28% improvement, no parameter tuning

Technical Details & Skills:
Software: MATLAB, Python (FastF1)
Parameters: 672 kW combined power, CD 1.503, CL −3.679
Result: 2.65% MAPE, 2.03 m/s RMSE
Skills: Numerical Methods, Vehicle Dynamics Basics, Data Analysis, Model Validation
MIT.nano — Semiconductor Packaging Training
NSF-ATE Northeast Consortium for Advanced Integrated Silicon | Jan–May 2026
Selected for a competitive cohort through MassBay Community College focused
on semiconductor electronic-photonic packaging and integration. Completed
an eight-week optics and photonics curriculum, followed by 15 hours of
hands-on semiconductor fabrication training in MIT's cleanroom — die
sawing, die bonding, wire bonding, and flip-chip bonding.





